Electroplating

High density CU – structures up to 210 µm end thickness are separated in the processing machine (German: LBA = Leiterbahnautomat) with 150A / m². Every electroplating process is equipped with a vibration device which removes blowing air bubbles from the smallest boreholes. It also guarantees a regular deposition rate of 25 µm minimum in the sleeve. Three to four m² throughputs per hour.